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Electronic Material Resin

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Encapsulant
Copper Clad Laminate
Electronic glue
photoresist

021-54580810

(Service hours 9:00~17:30)

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Phone：13127828772

QQ：339214877

Email：sample_hf@resicare.com.cn

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Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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