Phenol-biphenyl epoxy resin

Introduction Overview

A high-performance epoxy resin with a biphenyl backbone introduced into its molecules, combining the rigidity of biphenyl with the high reactivity of epoxy groups. The product exhibits ultra-high heat resistance, an extremely low coefficient of thermal expansion (CTE), excellent thermal stability, and high modulus. It is primarily used in high-end semiconductor packaging, high-performance copper clad laminates, and electronic components with extremely high reliability requirements.

Detailed specifications

grade	viscosity g/eq	softening point P/150°C	hydroxyl equivalent ℃	feature
Eziure™6000	265-285	0.4-1.1	53-63	Ultra-low water absorption, high heat resistance, excellent toughness
Eziure™6000L	261-282	0. 1-0.7	45-60
Eziure™6000H	280-300	2.5-4.5	65-75

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