Shanghai Hengfeng New Materials Technology Co., Ltd

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Quick Search： Linear phenolic resin 、modified arylalkyl phenolic resin 、 dicyclopentadiene phenolic epoxy resin 、 phenolic biphenyl epoxy resin

About Hengfeng

about Excellent electronic material supplier in the industry

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Hengfeng New Materials was established in 2018, focusing on the research and production of electronic grade special phenolic resins. The company was founded by a team of industry experts with over 20 years of experience, with 3 research institutes and 2 foreign consultants, dedicated to providing high-quality special resin material solutions for the semiconductor industry and other industries.
- 20year
  
  industry experience
- 38item
  
  floor area
- 2+
  
  production base
- 3ten thousand tons
  
  Annual production capacity of special phenolic resin
- 6ten thousand tons
  
  Annual production capacity of special phenolic epoxy resin
Corporate Vision

Corporate Mission

Corporate values

honor

honor Excellent electronic material supplier in the industry

Obtained 15 national level certificate certifications,
12 national level awards,
38 intellectual property rights,

Application field

application Material solutions for multi industry applications

Semiconductor Industry
Other Industries

Coating Industry

Tire Industry

Aerospace

Product Center

product Expert in electronic grade special phenolic resin/special phenolic epoxy resin industry

Electronic Material Resin

Encapsulant

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Copper Clad Laminate

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Electronic glue

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photoresist

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DCPD Epoxy Resin

A dicyclopentadiene phenol epoxy resin with high heat resistance, extremely low moisture absorption rate, and excellent dielectric properties (low Dk/Df), mainly used in high-end electronic packaging materials, semiconductor plastic packaging materials, high-frequency PCB copper-clad laminates, and high-performance composite materials.

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composite material

The company's core products are electronic-grade specialty phenolic resin and specialty epoxy resin, primarily serving the semiconductor industry and other related sectors. It is committed to providing key material solutions for the global electronic information industry

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Other Special Materials

Aerospace

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Composite material

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News and Information

NEWS Actively introducing international cutting-edge technological concepts

09/13 Company News

Hengfeng New Materials secured tens of millions of yuan in Pre-B round financing to accelerate the localization of core materials for semiconductor packaging

Shanghai Hengfeng New Material Technology Co., Ltd. (hereinafter referred to as "Hengfeng New Material") recently completed a Pre-...