Biscyclopentadiene phenolic epoxy resin

Introduction Overview

A dicyclopentadiene phenol epoxy resin with high heat resistance, extremely low moisture absorption rate, and excellent dielectric properties (low Dk/Df), mainly used in high-end electronic packaging materials, semiconductor plastic packaging materials, high-frequency PCB copper-clad laminates, and high-performance composite materials.

Detailed specifications

grade	viscosity g/eq	softening point P/150℃	hydroxyl equivalent ℃	feature
Eziure™5200L	240-255	0.2-0.5	50-60	低吸水性，高可靠性，韧性好
Eziure™5200	240-264	0.4-1.0	56-66
Eziure™5200H	260-280	2.5-4.5	75-85
Eziure™5200HH	270-290	6-12	85-95
Eziure™5200HHH	275-295	15-25	95-105