l  Shanghai Hengfeng New Materials Technology Co., Ltd. was founded in Shanghai,focusing on advanced materials for semiconductor packaging and copper clad laminate industries.

l  Secured strategic partnership and angel-round funding from Zhejiang Longsheng Group Co.,Ltd.

l  Completed a nearly 100-million-yuan Series A financing round.

l  Awarded the "High-Tech Enterprise" certification.

l  Established the wholly-owned subsidiary Jiangsu Hengfeng New Materials Technology Co., Ltd. A project with an annual output of 58,000 tons of electronic-grade phenolic resin and phenolic epoxy resin commenced in Taixing, Jiangsu, covering an area of 93 acres.

lThe holding subsidiary Anhui Hengfeng New Materials Technology Co., Ltd. was established in Bengbu, Anhui, covering 50 acres. The first phase, with a 10,000-ton electronic-grade phenolic resin capacity, commenced trial production.

lCompleted Series B financing round of over 100-million-yuan.

lExpanded core product offerings into the photoresist industry.