Development History

2022

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2021

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2020

l  Secured strategic partnership and angel-round funding from Zhejiang Longsheng Group Co.,Ltd.

2023

l  Completed a nearly 100-million-yuan Series A financing round.

2024

l  Awarded the "High-Tech Enterprise" certification.

l  Established the wholly-owned subsidiary Jiangsu Hengfeng New Materials Technology Co., Ltd. A project with an annual output of 58,000 tons of electronic-grade phenolic resin and phenolic epoxy resin commenced in Taixing, Jiangsu, covering an area of 93 acres.


2025

l  The holding subsidiary Anhui Hengfeng New Materials Technology Co., Ltd. was established in Bengbu, Anhui, covering 50 acres. The first phase, with a 10,000-ton electronic-grade phenolic resin capacity, commenced trial production.

l  Completed Series B financing round of over 100-million-yuan.

l  Expanded core product offerings into the photoresist industry.


2019

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2018

l  Shanghai Hengfeng New Materials Technology Co., Ltd. was founded in Shanghai,

focusing on advanced materials for semiconductor packaging and copper clad laminate industries.