Mar crystalline Epoxy resin

Introduction Overview

Crystalline epoxy resin with symmetrical molecular structure, characterized by high purity, low melt viscosity, excellent heat resistance, low dielectric constant, and high adhesion, is mainly used in high-frequency copper-clad laminates, IC packaging, 5G communication materials, and high-end electronic packaging fields

Detailed specifications

Product Model	Epoxy Equivalent Weight:g/eq	Viscosity:P/150℃	Softening Point:℃	Characteristics
Eziure™ 4700	175-195	≤0.1	105-115	High heat resistance,low stress,good fluidity
Eziure™ 4700H	180-200	≤0.15	100-120
Eziure™ 4700UL	170-190	≤0.1	100-120