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Copper Clad Laminate

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Triphenol type phenolic resin

Introduction Overview

A special high-purity phenolic resin with excellent heat resistance and chemical resistance. Used for high-end applications such as electronic grade epoxy sealing materials and high-speed copper-clad laminates.

Detailed specifications

Grade

Viscosity

P/150°C

Softening point

°C

Hydroxyl equivalent

g/eq

Feature

ResiCareâ3500

4.5-10

101-113

96-103

High Tg, chemical resistance, heat resistance


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027-87668892

(Service hours 9:00~18:00)

Recruitment Center

Phone：13817831983

QQ：138822333

Email：sample_hf@resicare.com.cn

Address：Room 102, Building 1, No. 3699 Yuanjiang Road, Minhang District, Shanghai

Official account

Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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