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Copper Clad Laminate

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Trisphenol Resin

Introduction Overview

A special high-purity phenolic resin with excellent heat resistance and chemical resistance. Used for high-end applications such as electronic grade epoxy sealing materials and high-speed copper-clad laminates.

Detailed specifications

Product Model

Viscosity:P/150℃

SofteningPoint:°C

Free Phenol-%

Characteristics

ResiCareâ3500

4.5-10

101-113

<0.2

High Tg, high flame retardancy, high heat resistance
ResiCareâ3500L 0.9-1.5 80-90
 <0.2


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021-54580810

(Service hours 9:00~17:30)

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Phone：13127828772

QQ：339214877

Email：sample_hf@resicare.com.cn

Address：Room 102, Building 1, No. 3699 Yuanjiang Road, Minhang District, Shanghai

Official account

Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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