Trisphenol Epoxy Resin

Introduction Overview

It is a three functional phenolic epoxy resin with a more rigid molecular structure compared to ordinary phenolic epoxy resin. When used in combination with phenolic resin, it can endow products with high Tg and high heat resistance. It is commonly used in high-performance circuit board/chip packaging and electronic adhesives

Detailed specifications

Product Model	Epoxy Equivalent Weight:g/eq	Viscosity:P/150℃	Softening Point:℃	Characteristics
Eziure™3501	162-172	0. 5-1.1	48-58	High Tg,High flame resistancy, High CTI
Eziure™3501L	155-165	0. 2-0.5	35-48
Eziure™3501H	163-175	1.1-2.0	58-65
Eziure™3501K80	162-172	3-10(25℃)	/