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Copper Clad Laminate

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DCPD Resin

Introduction Overview

A DCPD Resin with high heat resistance and extremely low moisture absorption rate, mainly used in high-end electronic packaging materials, semiconductor plastic packaging materials, high-frequency PCB copper-clad laminates, and high-performance composite materials.

Detailed specifications

Product Model

Viscosity:P/150℃

SofteningPoint:℃

Free Phenol-%

Characteristics


ResiCareâ2110LL

/

80-88

<0.1

Low water absorption, high heatresistance

ResiCareâ2110L

/

90-100

<0.1

ResiCareâ2110S

/

110-120

<0.1

ResiCareâ2110H

/

120-130

<0.1



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021-54580810

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Phone：13127828772

QQ：339214877

Email：sample_hf@resicare.com.cn

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Official account

Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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