Phosphorus modified phenolic aldehyde

Introduction Overview

It is a solvent based thermosetting phenolic resin modified with DOPO, which can be used in lead-free and halogen-free copper-clad laminates. The product has good compatibility with butanone, high heat resistance, flame retardancy, chemical resistance, and excellent electrical performance.

Detailed specifications

Grade	Viscosity Cps/20°C	Solid content °C	Phosphorus content %	Free DOPO %	Hydroxyl equivalent g/eq	Feature
ResiCareâ3802F	400-3000	56-61	9.2-9.5	<1	320-360	Fast curing
ResiCareâ3802M	400-3000	56-61	9.2-9.5	<1	320-360	Ordinary universal
ResiCareâ3802A	400-3500	56-61	9.2-9.5	<0.1	320-360	Low free DOPO
ResiCareâ3802D	400-3500	56-61	9.2-9.5	<0.1	320-360	High compatibility, low Df