DOPO Modified Resin

Introduction Overview

It is a solvent based thermosetting phenolic resin modified with DOPO, which can be used in lead-free and halogen-free copper-clad laminates. The product has good compatibility with butanone, high heat resistance, flame retardancy, chemical resistance, and excellent electrical performance.

Detailed specifications

Product Model	Viscosity:P/25℃	SolidContent:%	DOPO Free:%	Characteistics
ResiCareâ3802FD	300-3000	56-61	<1	Fast curing,lower dielectric
ResiCareâ3802M	300-3000	56-61	<1	Regular style,better craftsmanship widow
ResiCareâ3802MH	300-3000	56-61	<1	Medium curing speed
ResiCareâ3802D	300-3000	56-61	<1	Good solvent comatibility
ResiCareâ3802A/U	300-4000	56-61	<0.03	Ultra low free monomer