Arylalkyl phenolic resin

Introduction Overview

Used in electronic-grade epoxy molding compounds and other epoxy curing systems, the product features low water absorption, high toughness, and chemical resistance It possesses characteristics such as good electrical conductivity and high heat resistance.

Detailed specifications

grade	viscosity P/150°C	softening point °C	hydroxyl equivalent g/eq	feature
ResiCareâ3600	0.4-0.7	57-64	173-177	Low water absorption, medium toughness, heat resistance
ResiCareâ3600-4L	0.5-0.9	57-64	167-177
ResiCareâ3600LL	0.8-1.2	63-73	173-177
ResiCareâ3600L	0.8-1.5	65-75	173-177
ResiCareâ3600H	1.6-3.0	68-78	173-179