中 / EN
Quickly find the product you want to know about
Search
Quick Search： Linear phenolic resin 、modified arylalkyl phenolic resin 、 dicyclopentadiene phenolic epoxy resin 、 phenolic biphenyl epoxy resin

Encapsulant

All Products
Back

Xylok Resin

Introduction Overview

Used in electronic-grade epoxy molding compounds and other epoxy curing systems, the product features low water absorption, high toughness, and chemical resistance It possesses characteristics such as good electrical conductivity and high heat resistance.

Detailed specifications

Product Model

Viscosity:P/150℃

SofteningPoint:°C

Free Phenol-%

Characteristics

ResiCareâ3600

0.4-0.7

57-64

<0.1

Low water absorption; High heat resistance;High flame retardancy

ResiCareâ3600-4L

0.5-0.9

57-64

<0.1

ResiCareâ3600L

0.8-1.5

65-75

<0.1

ResiCareâ3600H

1.6-3.0

68-78

<0.1

ResiCareâ3600M

3.6-5.0

78-84

<0.1


Sample Application Form

Name *
Tel *
Company *
Email
content
Submit

021-54580810

(Service hours 9:00~17:30)

Recruitment Center

Phone：13127828772

QQ：339214877

Email：sample_hf@resicare.com.cn

Address：Room 102, Building 1, No. 3699 Yuanjiang Road, Minhang District, Shanghai

Official account

Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
Privacy Policy | Contact Us