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Phenol biphenyl epoxy resin

Introduction Overview

A high-performance epoxy resin that introduces a biphenyl skeleton into its molecules, combining the rigidity of biphenyl with the high reactivity of epoxy groups. The product has ultra-high heat resistance, extremely low coefficient of thermal expansion (CTE), excellent thermal stability, and high modulus. It is mainly used for high-end semiconductor packaging, high-performance copper-clad laminates, and electronic components with extremely high reliability requirements.

Detailed specifications

Grade

Epoxy equivalent

g/eq

Viscosity

P/150°C

Softening point

Feature

Eziure6000

265-285

0.4-1.1

53-63

Low water absorption,

High heat resistance,

Excellent toughness

Eziure6000L

261-282

0.   1-0.7

45-60

Eziure6000H

280-300

2.5-3.5

65-75



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