Phenolic epoxy resin

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Tetramethylbiphenyl epoxy resin

Introduction Overview

Crystalline epoxy resin with symmetrical molecular structure, characterized by high purity, low melt viscosity, excellent heat resistance, low dielectric constant, and high adhesion, is mainly used in high-frequency copper-clad laminates, IC packaging, 5G communication materials, and high-end electronic packaging fields

Detailed specifications

Grade

Epoxy equivalent

g/eq

Softening point

°C

Viscosity

P/150

Feature

Eziure 4700

175-195

105-115

≤0.1

Low melt viscosity.

High Tg, high adhesion, etc


Eziure 4700H

180-200

100-120

0.15



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