Biscyclopentadiene phenolic resin

Introduction Overview

A dicyclopentadiene phenol epoxy resin with high heat resistance, extremely low moisture absorption rate, and excellent dielectric properties (low Dk/Df), mainly used in high-end electronic packaging materials, semiconductor plastic packaging materials, high-frequency PCB copper-clad laminates, and high-performance composite materials.

Detailed specifications

Grade	Softening point °C	Free phenol %	Hydroxyl equivalent q/eq	Feature
ResiCareâ2110LL	80-88	<0.1	140-150	Low water absorption, high toughness, Low Dk/Df
ResiCareâ2110L	90-100	<0.1	165-175
ResiCareâ2110S	110-120	<0.1	180-190
ResiCareâ2110H	120-130	<0.1	190-195
ResiCareâ2110HH	130-140	<0.1	190-195