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phenolic resin

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Novolac

Introduction Overview

Used in a series of epoxy curing systems such as electronic grade epoxy molding compounds and copper-clad laminates, the product has strong applicability, high stability, and stable thermal rheological properties, and is suitable for single component or multi-component epoxy curing systems.

Detailed specifications

Grade

Softening point

°C

Free phenol

%

Feature

ResiCareâ3020

94-100

<0.1

ResiCareâ3108

104-109

<0.1

Linear phenolic aldehyde, universal FR4 curing agent

ResiCareâ3120

113-118

<0.1


Grade

Solid content

%

Free phenol

%

Feature

ResiCareâ3165S

63-67

<0.1

Solvent based electronic phenolic resin

ResiCareâ3166S

63-67

<0.1



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Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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