DCPD Epoxy Resin

Introduction Overview

A dicyclopentadiene-phenol epoxy resin, this product boasts high heat resistance, extremely low moisture absorption rate, and excellent dielectric properties (low Dk/Df). It is primarily used in high-end electronic packaging materials, semiconductor encapsulants, high-frequency PCB copper-clad laminates, and high-performance composite materials.

Detailed specifications

Product Model	Epoxy Equivalent Weight:g/eq	Viscosity:P/150℃	Softening Point:℃	Characteristics
Eziure™5200	252-264	0.4-1.0	56-66	Low CTE,high CTI,low dielectric
Eziure™5200L	240-255	0.2-0.5	50-60
Eziure™5200K75	252-264	0.4-1.0	56-66
Eziure™5200H	260-280	2.5-4.5	75-85
Eziure™5200HK75	260-280	2.5-4.5	75-85
Eziure™5200HDK75	260-280	2.5-4.5	75-85
Eziure™5200HHHEK75	275-295	15-25	95-105

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