Dicyclopentadiene phenolic epoxy resin

Introduction Overview

A dicyclopentadiene-phenol epoxy resin, this product boasts high heat resistance, extremely low moisture absorption rate, and excellent dielectric properties (low Dk/Df). It is primarily used in high-end electronic packaging materials, semiconductor encapsulants, high-frequency PCB copper-clad laminates, and high-performance composite materials.

Detailed specifications

Grade	Epoxy equivalent g/eq	Viscosity P/150℃	Softening point ℃	Feature
Eziure™5200	252-264	0.4-1.0	56-66	Low water absorption, high reliability, low Df
Eziure™5200K75	252-264	-	56-66
Eziure™5200H	260-280	2.5-4.5	75-85
Eziure™5200HK75	260-280	-	75-85
Eziure™5200HH	270-290	6-12	85-95
Eziure™5200HHH	275-295	15-25	95-105
Eziure™5200HHHK75	275-295	-	95-105

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