Mar crystalline Epoxy resin

Introduction Overview

Crystalline epoxy resin with a symmetrical molecular structure boasts high purity, low melt viscosity, excellent heat resistance, low dielectric constant, and high adhesion. It is primarily used in high-frequency copper-clad laminates, IC packaging, 5G communication materials, and high-end electronic packaging fields

Detailed specifications

Product Model	Epoxy Equivalent Weight:g/eq	Viscosity:P/150℃	Softening Point:℃	Characteristics
Eziure™ 4700	175-195	≤0.1	105-115	High heat resistance,low stress,good fluidity
Eziure™ 4700H	180-200	≤0.15	100-120
Eziure™ 4700UL	170-190	≤0.1	100-120