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Tetramethyl biphenyl type epoxy resin

Introduction Overview

Crystalline epoxy resin with a symmetrical molecular structure boasts high purity, low melt viscosity, excellent heat resistance, low dielectric constant, and high adhesion. It is primarily used in high-frequency copper-clad laminates, IC packaging, 5G communication materials, and high-end electronic packaging fields

Detailed specifications

grade

 viscosity

g/eq

softening point  

°C

hydroxyl equivalent 

P/150℃

feature

Eziure™ 4700

175-195

105-115

≤0.1

Low melt viscosity

High Tg, high adhesion, etc

Eziure™ 4700H

180-200

100-120

≤0.15


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