Trisphenol Epoxy Resin

Introduction Overview

It is a Trisphenolic Epoxy Resin. Compared to ordinary phenolic epoxy resin, its molecular structure is more rigid. When used in combination with phenolic resin, it can impart high Tg and high heat resistance to products, and is commonly used in high-performance circuit boards/chip packaging and electronic adhesives

Detailed specifications

Product Model	Epoxy Equivalent Weight:g/eq	Viscosity:P/150℃	Softening Point:℃	Characteristics
Eziure™3501	162-172	0. 5-1.1	48-58	High Tg,High flame retardancy,High CTI
Eziure™3501L	155-165	0. 2-0.5	35-48
Eziure™3501H	163-175	1.1-2.0	58-65
Eziure™3501K80	162-172	3-10(25°C)	/