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Phenol-biphenyl epoxy resin

Introduction Overview

A high-performance epoxy resin with a biphenyl backbone introduced into its molecules, combining the rigidity of biphenyl with the high reactivity of epoxy groups. The product exhibits ultra-high heat resistance, an extremely low coefficient of thermal expansion (CTE), excellent thermal stability, and high modulus. It is primarily used in high-end semiconductor packaging, high-performance copper clad laminates, and electronic components with extremely high reliability requirements.

Detailed specifications

grade 

 viscosity

g/eq

 softening point

P/150°C

hydroxyl equivalent

feature

Eziure6000

265-285

0.4-1.1

53-63

Ultra-low water absorption, high heat resistance, excellent toughness

Eziure6000L

261-282

0. 1-0.7

45-60

Eziure6000H

280-300

2.5-4.5

65-75


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