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Modified Mar Resin

Introduction Overview

It is a low softening point, Modified Mar Resin. The product has achieved ultra-low monomer and ultra-low ionic content through special processes, making it suitable for use in electronic-grade epoxy molding compounds and other series of epoxy curing systems. The product features low water absorption, high toughness, chemical resistance, and high heat resistance.

Detailed specifications

Product Model

Viscosity:P/150℃

SofteningPoint:

°C

Free Phenol-%

Characteristics

ResiCareâ3910

0.6 – 1.0

69-79

<1

Ultra low water absorption, high heat resis-tance, high flame retardancy, and higher fluidity


Sample Application Form

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021-54580810

(Service hours 9:00~17:30)

Recruitment Center

Phone：13127828772

QQ：339214877

Email：sample_hf@resicare.com.cn

Address：Room 102, Building 1, No. 3699 Yuanjiang Road, Minhang District, Shanghai

Official account

Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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