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Modified biphenyl phenolic resin

Introduction Overview

It is a low softening point, modified biphenyl phenolic resin. The product has achieved ultra-low monomer and ultra-low ionic content through special processes, making it suitable for use in electronic-grade epoxy molding compounds and other series of epoxy curing systems. The product features low water absorption, high toughness, chemical resistance, and high heat resistance.

Detailed specifications

grade

viscosity

P/150°C

softening point

°C

hydroxyl equivalent

g/eq

feature

ResiCareâ3910

0.6 – 1.0

69-79

178-202

Low water absorption, high toughness, high reliability


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027-87668892

(Service hours 9:00~18:00)

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Phone：13817831983

QQ：138822333

Email：sample_hf@resicare.com.cn

Address：Room 102, Building 1, No. 3699 Yuanjiang Road, Minhang District, Shanghai

Official account

Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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