Phenolic resin

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Modified aralkyl phenolic resin

Introduction Overview

It is a modified aralkyl phenolic resin with a low softening point. The product, processed through special techniques, achieves ultra-low monomer and ultra-low ionic content characteristics, making it suitable for use in electronic-grade epoxy molding compounds and other series of epoxy curing systems. The product features low water absorption, high toughness, chemical resistance, and high heat resistance.

Detailed specifications

grade

viscosity

P/150°C

 softening point

°C

hydroxyl equivalent

g/eq

feature

ResiCare3610

0.3-0.7

68-78

147-161

Low water absorption rate, high reliability


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