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Phenolic resin

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Xylok Resin

Introduction Overview

Used in electronic-grade epoxy molding compounds and other epoxy curing systems, the product features low water absorption, high toughness, and chemical resistance It possesses characteristics such as good electrical conductivity and high heat resistance.

Detailed specifications

Product Model

Viscosity:P/150℃

SofteningPoint:°C

Free Phenol-%

Characteristics

ResiCareâ3600

0.4-0.7

57-64

<0.1

Low water absorption; High heat resistance;High flame retardancy

ResiCareâ3600-4L

0.5-0.9

57-64

<0.1

ResiCareâ3600L

0.8-1.5

65-75

<0.1

ResiCareâ3600H

1.6-3.0

68-78

<0.1

ResiCareâ3600M

3.6-5.0

78-84

<0.1


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021-54580810

(Service hours 9:00~17:30)

Recruitment Center

Phone：13127828772

QQ：339214877

Email：sample_hf@resicare.com.cn

Address：Room 102, Building 1, No. 3699 Yuanjiang Road, Minhang District, Shanghai

Official account

Record number: E ICP preparation XXXXXXXXX No. -1 © 2025 Shanghai Hengfeng New Material Technology Co., Ltd. All rights reserved
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