Phenolic Resin

Introduction Overview

It is used in electronic-grade epoxy molding compounds, copper clad laminates, and other epoxy curing systems. The product has strong process applicability, high stability, and stable thermorheological properties, making it suitable for single-component or multi-component epoxy curing systems

Detailed specifications

Product Model	Viscosity:P/150℃	SofteningPoint: °C	Free Phenol-%	Characteristics
ResiCareâ3004	0.4–0.9	64-75	<0.1	Medium-to-high flame retardancy; Conven-tional epoxycuring agent
ResiCareâ3008	0.8-1.0	72-79	<0.1
ResiCareâ3010	1.4-2.0	80-86	<0.1
ResiCareâ3015	5.7-6.4	90-96	<0.1
ResiCareâ3020	10.0-12.0	95-101	<0.1
ResiCareâ3030	45.5-50.5	110-117	<0.1
ResiCareâ3105	1.3-1.9 (175℃)	94-100	<0.05
ResiCareâ3108	3.5-6.0 (175℃)	104-109	<0.05
ResiCareâ3120	9.0-30(175℃)	113-118	<0.05

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