Linear phenolic resin

Introduction Overview

It is used in electronic-grade epoxy molding compounds, copper clad laminates, and other epoxy curing systems. The product has strong process applicability, high stability, and stable thermorheological properties, making it suitable for single-component or multi-component epoxy curing systems

Detailed specifications

grade	viscosity P/150°C	softening point °C	Hydroxyl equivalent g/eq	feature
ResiCareâ3004	0.4–0.9	64-75	102-106
ResiCareâ3008	0.8-1.0	72-79	103-107	Linear phenolic, conventional electronic phenolic
ResiCareâ3010	1.4-2.0	80-86	104-108
ResiCareâ3015	5.7-6.4	90-96	105-109
ResiCareâ3010M	1.8-2.2	80-86	104-108
ResiCareâ3015M	5.7-6.4	90-96	105-109
ResiCareâ3020	10.0-12.0	95-101	106-110
ResiCareâ3025	14.5-22	100-106	107-112

Sample Application Form

Name *

Tel *

Company *

content

Submit